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		<title>部件 on Extra Performance IR Heating</title>
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				<title>半导体机械零部件贸易</title>
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				<pubDate>Mon, 01 Jun 2026 20:26:06 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-extra.com/images/eeeb9669114c0c0a0b2bef3f902d01a9.png&#34; alt=&#34;半导体机械零部件贸易&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在晶圆厂车间，良率的成败取决于可依赖的温度控制。光刻胶烘烤温度的漂移会导致关键尺寸（CD）均匀性偏差。晶圆干燥过程中的热点则容易产生微缺陷。封装固化不足会导致层间剥离。凭经验操作无法满足要求。&lt;/p&gt;</description>
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